At the Broadband World Forum 2022, Fibocom, a major global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announced the global debut of the 5G module FG370. The FG370 is expected to provide improved mobile broadband, low latency, and ultra-reliable 5G Fixed Wireless Access (FWA) connectivity for international operators. It is powered by the recently released MediaTek T830 platform.
The 5G Sub-6GHz module FG370, which complies with 3GPP Release 16 (R16) standards, allows users to theoretically enjoy 5G speeds of up to 7.01Gbps on the downlink and 2.5Gbps on the uplink. The FG370 supports 4CC CA (Carrier Aggregation) and up to 300 MHz of spectrum, as well as 2CC CA and up to 200 MHz of spectrum, which improves the usage of spectrum resources and ensures a longer 5G coverage. It is powered by a quad-core Arm Cortex-A55 CPU. The module supports LTE-TDD, LTE-FDD, and WCDMA network protocols and is backward compatible with 5G standalone network (SA) and non-standalone (NSA) network architectures.
Additionally, the 8 RX (Receive Antennas) supported by the FG370 improve downlink speed, spectrum efficiency, and coverage quality. Additionally, the module supports Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), which permits a maximum transmit power of up to 29dBm, which is 6dB higher than that of PC3 and 3dB higher than that of PC2, respectively. This feature significantly boosts uplink speed and widens uplink coverage. With improvements to uplink and downlink speed and coverage, FG370 can deliver seamless 5G connectivity for FWA while improving user experience.
A few noteworthy expanded connection options that the FG370 can handle include Dual-band 22 Wi-Fi 7 for MiFi (BE6500) and Tri-band 44 Wi-Fi 7 for CPE (BE19000). These solutions include new Wi-Fi 7 features like Multi-Link Operation, 4096 QAM, and the 160MHz/320MHz bandwidth and 6GHz frequency spectrum (MLO). The module also facilitates the deployment of wired networks, supporting up to 10Gb Ethernet and meeting the needs of various applications.
The FG370 effortlessly supports a wide range of IoT applications, giving consumers a high-speed 5G experience. It has a comprehensive expansion of interfaces, including 10GbE USXGMII/ PCI-Express/USB 3.2, as well as PCM/SPI for connection to external SLIC for RJ11 phone ports. Additionally, MediaTek’s 5G UltraSave technologies are included with the module to maximize energy saving for 5G connections, particularly 5G MiFi.
According to Simon Tao, General Manager of Fibocom’s MBB Product Management Department, “Fibocom is thrilled to partner with MediaTek to contribute to the dissemination of 5G.” “We’re thrilled to present the next generation of 5G module FG370 to the global FWA market,” says the company. “With expanded coverage, greater throughput, and optimized capacity, 5G commercialization will be further boosted.”
Launched by Fibocom, the MediaTek T830 platform-based 5G module FG370.